For Laptops, Speed: PC3L-12800, Module Specification: 260Pin SO-DIMM. CAS.Latency: CL11, Working Voltage: 1.35V High speed up to 1600MHz, Transfer bandwidth up to 12.8GB/s. 6-layer PCB provides improved signal transfer and system stability Energy efficient: save up to 10% compared to DDR3. Operating Temperature: 0°C-85°C Supports Intel Skylake and Coffee Lake platforms, future-proof for Kaby Lake & Cannon Lake platforms. Complies with JEDEC standards and RoHS compliant ADATA standard SO-DIMM, Very Low-Profile modules (VLP), or small outline modules (SO-DIMM) for notebooks, all implement cutting edge technology that enables remarkable memory quality, stability, and reliability
